NAND型フラッシュメモリ | BENAND (Built-in ECC SLCNAND)|パッケージ : FBGA
| 型番 | TC58BVG0S3HBAI4 |
|---|---|
| メーカー | TOSHIBA |
| カテゴリ | フラッシュメモリ |
| 種別 | NAND型フラッシュメモリ |
| データシート | ![]() |
| Alternate Memory Width | 1 |
| Command User Interface | YES |
| Data Polling | NO |
| JESD-30 Code | R-PBGA-B63 |
| Length | 11 mm |
| Memory Density | 1073741824 bit |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Sectors/Size | 1K |
| Number of Terminals | 63 |
| Number of Words | 134217728 words |
| Number of Words Code | 128M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 128MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA |
| Package Equivalence Code | BGA63,10X12,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter |
| Page Size | 2K words |
| Parallel/Serial | PARALLEL |
| Programming Voltage | 3.3 V |
| Ready/Busy | YES |
| Seated Height-Max | 1 mm |
| Sector Size | 128K Words |
| Standby Current-Max | 5.0E-5 Amp |
| Supply Current-Max | 0.03 mA |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Toggle Bit | NO |
| Type | NAND TYPE |
| VCC (V) | 2.7 to 3.6 |
| Width | 9 mm |
| Write Cycle Time-Max (tWC) | 2.5E-5 ms |
| ピン数 | 63 |
| ブロックサイズ(bit) | (128K+4K) x 8 |
| ページサイズ(bit) | (2048+64) x 8 |
| 世代(nm) | 24 |
| 分類名 | BENAND (Built-in ECC SLCNAND) |
| 動作温度(degC) | -40 to 85 |
| 容量(bit) | 1G |
| 会社名称 | 株式会社東芝 |
|---|---|
| 設立 | 1875年7月 |
| 資本金 | 4,399億円 |
| 所在地 | 東京都港区芝浦1-1-1 |
| URL | http://www.semicon.toshiba.co.jp/eng/ |
TC58BVG0S3HBAI4 - TOSHIBA の商品詳細ページです。