SN74AVC2T872YFPR データシート Ti

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SN74AVC2T872YFPR の詳細情報

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型番SN74AVC2T872YFPR
メーカーTI
データシートProduct_list_pdf
Interface IC Type INTERFACE CIRCUIT
JESD-30 Code R-PBGA-B12
JESD-609 Code e1
Length 1.57 mm
Moisture Sensitivity Level 1
Number of Bits 2
Number of Functions 1
Number of Terminals 12
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Output Characteristics PUSH-PULL
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA12,3X4,16
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 1.2/3.3 V
Qualification Status Not Qualified
Seated Height-Max 0.5 mm
Sub Category Other Interface ICs
Supply Current-Max 0.04 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 1.1 V
Supply Voltage-Nom 1.2 V
Supply Voltage1-Max 3.6 V
Supply Voltage1-Min 1.1 V
Supply Voltage1-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.17 mm
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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