SN74AUP1T58YFPR データシート Ti

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SN74AUP1T58YFPR の詳細情報

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型番SN74AUP1T58YFPR
メーカーTI
データシートProduct_list_pdf
Interface IC Type INTERFACE CIRCUIT
JESD-30 Code R-XBGA-B6
JESD-609 Code e1
Length 1.4 mm
Moisture Sensitivity Level 1
Number of Bits 1
Number of Functions 1
Number of Terminals 6
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Output Characteristics PUSH-PULL
Package Body Material UNSPECIFIED
Package Code VFBGA
Package Equivalence Code BGA6,2X3,16
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 2.5/3.3 V
Qualification Status Not Qualified
Seated Height-Max 0.5 mm
Sub Category Other Interface ICs
Supply Current-Max 0.0009 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.3 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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