SN74AUP1G97YZPR データシート Ti

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SN74AUP1G97YZPR の詳細情報

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型番SN74AUP1G97YZPR
メーカーTI
データシートProduct_list_pdf
Family AUP/ULP/V
JESD-30 Code R-XBGA-B6
JESD-609 Code e1
Length 1.4 mm
Load Capacitance (CL) 30 pF
Logic IC Type LOGIC CIRCUIT
Max I(ol) 0.004 Amp
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 6
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Output Characteristics 3-STATE
Output Polarity TRUE
Package Body Material UNSPECIFIED
Package Code VFBGA
Package Equivalence Code BGA6,2X3,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supplies 1.2/3.3 V
Prop. Delay@Nom-Sup 26.7 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 0.5 mm
Sub Category Gates
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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