LMV225TL/NOPB Ti

LMV225TL/NOPB - TI の商品詳細ページです。

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LMV225TL/NOPB の詳細情報

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型番LMV225TL/NOPB
メーカーTI
JESD-30 Code S-PBGA-B4
JESD-609 Code e1
Length 1.014 mm
Moisture Sensitivity Level 1
Number of Channels 1
Number of Functions 1
Number of Terminals 4
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.675 mm
Supply Current-Max 8 mA
Supply Voltage-Nom 2.7 V
Surface Mount YES
Telecom IC Type RF AND BASEBAND CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 1.014 mm
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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