LMH0344GR データシート Ti

LMH0344GR - TI の商品詳細ページです。

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LMH0344GR の詳細情報

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型番LMH0344GR
メーカーTI
データシートProduct_list_pdf
Data Rate 2970000 Mbps
JESD-30 Code S-PBGA-B25
JESD-609 Code e1
Length 3 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 25
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA25,5X5,20
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 3.3 V
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Sub Category Other Telecom ICs
Supply Current-Max 0.1 mA
Supply Voltage-Nom 3.3 V
Surface Mount YES
Telecom IC Type LINE EQUALIZER
Temperature Grade INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 3 mm
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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