LM8322JGR8 データシート Ti

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LM8322JGR8 の詳細情報

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型番LM8322JGR8
メーカーTI
データシートProduct_list_pdf
JESD-30 Code S-PBGA-B36
JESD-609 Code e1
Length 3.5 mm
Moisture Sensitivity Level 1
Number of Terminals 36
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA36,6X6,20
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 1.8 V
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Sub Category Other Microprocessor ICs
Supply Current-Max 3 mA
Supply Voltage-Max 1.98 V
Supply Voltage-Min 1.62 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 3.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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