DM355SDZCE270 データシート Ti

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DM355SDZCE270 の詳細情報

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型番DM355SDZCE270
メーカーTI
データシートProduct_list_pdf
Additional Feature IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
Bit Size 32
Format FIXED POINT
JESD-30 Code S-PBGA-B337
JESD-609 Code e1
Length 13 mm
Moisture Sensitivity Level 3
Number of Terminals 337
Operating Temperature-Max 85 Cel
Operating Temperature-Min 0 Cel
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA337,19X19,25
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 1.3,1.8,3.3 V
Qualification Status Not Qualified
RAM (words) 8192
Seated Height-Max 1.3 mm
Sub Category Digital Signal Processors
Supply Voltage-Max 1.365 V
Supply Voltage-Min 1.235 V
Supply Voltage-Nom 1.3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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