BUF08630RGWR データシート Ti

BUF08630RGWR - TI の商品詳細ページです。

1
No Image
2営業日以内に回答いたします

BUF08630RGWR の詳細情報

  • 仕様・詳細
  • メーカー情報
型番BUF08630RGWR
メーカーTI
データシートProduct_list_pdf
Analog IC - Other Type ANALOG CIRCUIT
JESD-30 Code S-PQCC-N20
JESD-609 Code e4
Length 5 mm
Moisture Sensitivity Level 2
Number of Channels 8
Number of Functions 1
Number of Terminals 20
Operating Temperature-Max 95 Cel
Operating Temperature-Min -40 Cel
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC20,.20SQ,25
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 2,18 V
Qualification Status Not Qualified
Seated Height-Max 1 mm
Sub Category Other Analog ICs
Supply Voltage-Max (Vsup) 20 V
Supply Voltage-Min (Vsup) 9 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5 mm
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

BUF08630RGWRのレビュー

BUF08630RGWR のご注文について