AM3352ZCZD72 Ti

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AM3352ZCZD72 の詳細情報

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型番AM3352ZCZD72
メーカーTI
Address Bus Width 28
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 26 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B324
JESD-609 Code e1
Length 15 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA324,18X18,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 0.95/1.1,0.95/1.26 V
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Speed 720 rpm
Sub Category Microprocessors
Supply Voltage-Max 1.326 V
Supply Voltage-Min 1.21 V
Supply Voltage-Nom 1.26 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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