AM1806BZCED4 データシート Ti

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AM1806BZCED4 の詳細情報

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型番AM1806BZCED4
メーカーTI
データシートProduct_list_pdf
Address Bus Width 23
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 30 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B361
JESD-609 Code e1
Length 16 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 361
Operating Temperature-Max 90 Cel
Operating Temperature-Min -40 Cel
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA361,19X19,25
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Peak Reflow Temperature (Cel) 260
Power Supplies 1.3,1.8,3.3 V
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Speed 456 rpm
Sub Category Microprocessors
Supply Voltage-Max 1.35 V
Supply Voltage-Min 1.25 V
Supply Voltage-Nom 1.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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