66AK2E05XABD25 Ti

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66AK2E05XABD25 の詳細情報

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型番66AK2E05XABD25
メーカーTI
Address Bus Width 16
Boundary Scan YES
External Data Bus Width 16
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B1089
JESD-609 Code e1
Length 27 mm
Low Power Mode YES
Moisture Sensitivity Level 4
Number of DMA Channels 5
Number of Terminals 1089
On Chip Data RAM Width 8
Operating Temperature-Max 85 Cel
Operating Temperature-Min 0 Cel
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH Meter
RAM (words) 2097152
Seated Height-Max 3.55 mm
Speed 1250 rpm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
会社名称Texas Instruments Incorporated.
設立1930
資本金USD 816 million
所在地12500 TI Boulevard Dallas, Texas 75243 USA
URLhttp://www.ti.com/

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