Advanced 低電圧CMOS
| 型番 | HD74ALVC2G06US |
|---|---|
| メーカー | RENESAS |
| カテゴリ | その他-汎用IC |
| 種別 | Advanced 低電圧CMOS |
| データシート | ![]() |
| Activity | - |
| Application | - |
| Automotive | - |
| BusFormat | - |
| Channel(ch) | - |
| Description | - |
| Family | ALVC/VCX/A |
| Family. | 74ALVC2G Series |
| Features | - |
| Function | Triple Inverter Buffers/Drivers with Open Drain |
| II (mA) | - |
| Icc(mA)max. | - |
| Io (mA) /Duty ratio (%) | - |
| Iout(mA) | +24 |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e0 |
| Length | 2.3 mm |
| Load Capacitance (CL) | 30 pF |
| Logic IC Type | INVERTER |
| Max I(ol) | 0.024 Amp |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 3 |
| Number of Inputs | 1 |
| Number of Terminals | 8 |
| Numberof Channel | 3 |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Output Characteristics | OPEN-DRAIN |
| OutputFrequency(MHz) max. | - |
| OutputFrequency(MHz) min. | - |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VSSOP |
| Package Equivalence Code | TSSOP8,.12,20 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH Meter |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Performance | - |
| Power Supplies | 3.3 V |
| Prop. Delay@Nom-Sup | 2.5 ns |
| Propagation Delay (tpd) | 7 ns |
| PropagationDelay(ns) max. | 2.5 |
| Pt (W) | - |
| Qualification Status | Not Qualified |
| SSC clock outfreq. ratio(XIN: SSCOUT) | - |
| SSCModuration | - |
| Schmitt Trigger | NO |
| Seated Height-Max | 0.9 mm |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 1.2 V |
| Supply Voltage-Nom (Vsup) | 1.5 V |
| Surface Mount | YES |
| Targetapplication | - |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Topa[Tjopa](degC)max. | 85 |
| Topa[Tjopa](degC)min. | -40 |
| Usage/field | - |
| Vcc(V)max. | 3.6 |
| Vcc(V)min. | 1.2 |
| Vo(V) | - |
| Vo(V)max. | - |
| Waferprocess | - |
| Width | 2 mm |
| シミュレーションデータ | IBIS |
| ステータス | In Mass Production |
| パッケージコード | PVSP0008KA-A(TTP-8DBV) |
| ピン数 | 8 |
| 備考 | Under development |
| 構成[素子] | - |
| 機能中分類 | Inverter |
| 機能大分類 | Buffer |
| 発注制約 | - |
| 会社名称 | ルネサス エレクトロニクス株式会社 |
|---|---|
| 設立 | 2002年11月1日 |
| 資本金 | 100億円 |
| 所在地 | 135-0061 東京都江東区豊洲三丁目2番24号 |
| URL | http://am.renesas.com/ |
HD74ALVC2G06US - RENESAS の商品詳細ページです。