型番 | M2GL090-FG676I |
---|---|
メーカー | MICROCHIP |
DLA Qualification | Not Qualified |
J-STD-609 Code | e0 |
JESD-30 Code | S-PBGA-B676 |
JESD-609 Code | e0 |
Length | 27 mm |
Length (mm) | 27 |
Moisture Sensitivity Level | 3 |
Number of Inputs | 425 |
Number of Logic Cells | 86316 |
Number of Outputs | 425 |
Number of Terminals | 676 |
Operating Temperature-Max | 100 Cel |
Operating Temperature-Max (Cel) | 100 |
Operating Temperature-Min | -40 Cel |
Operating Temperature-Min (Cel) | -40 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA676,26X26,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY Meter |
Packing Method | TRAY |
Peak Reflow Temperature (Cel) | 225 |
Power Supplies | 1.2 V |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified |
Seated Height-Max | 2.44 mm |
Seated Height-Max (mm) | 2.44 |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Max | 1.26 V |
Supply Voltage-Max (V) | 1.26 |
Supply Voltage-Min | 1.14 V |
Supply Voltage-Min (V) | 1.14 |
Supply Voltage-Nom | 1.2 V |
Supply Voltage-Nom (V) | 1.2 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 1 mm |
Terminal Pitch (mm) | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 20 |
Width | 27 mm |
Width (mm) | 27 |
会社名称 | Microchip Technology Inc. |
---|---|
所在地 | 2355 West Chandler Blvd. Chandler, Arizona, USA 85224-6199 |
URL | http://www.microchip.com/ |
M2GL090-FG676I - MICROCHIP の商品詳細ページです。