IS61DDB24M18-300M3L データシート Issi

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IS61DDB24M18-300M3L の詳細情報

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型番IS61DDB24M18-300M3L
メーカーISSI
データシートProduct_list_pdf
Access Time-Max 0.35 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4M
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 Cel
Operating Temperature-Min 0 Cel
Organization 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE Meter
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Power Supplies 1.5/1.8,1.8 V
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Sub Category SRAMs
Supply Current-Max 0.6 mA
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 15 mm
会社名称Integrated Silicon Solution, Inc.
設立1988
所在地1623 Buckeye Dr.Milpitas, California 95035
URLhttp://www.issi.com/

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