IS61DDB22M18-250M3 データシート Issi

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IS61DDB22M18-250M3 の詳細情報

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型番IS61DDB22M18-250M3
メーカーISSI
データシートProduct_list_pdf
Access Time-Max 0.35 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 17 mm
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Memory Width 18
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2M
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 Cel
Operating Temperature-Min -40 Cel
Organization 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY Meter
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Power Supplies 1.5/1.8,1.8 V
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.2 Amp
Standby Voltage-Min 1.7 V
Sub Category SRAMs
Supply Current-Max 0.55 mA
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 15 mm
会社名称Integrated Silicon Solution, Inc.
設立1988
所在地1623 Buckeye Dr.Milpitas, California 95035
URLhttp://www.issi.com/

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