型番 | HY5S5B2CLFP-6E |
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メーカー | HYUNDAI |
Access Mode | FOUR BANK PAGE BURST |
Access Time-Max | 5.4 ns |
Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 166 MHz |
I/O Type | COMMON |
Interleaved Burst Length | 1,2,4,8 |
JESD-30 Code | R-PBGA-B90 |
JESD-609 Code | e1 |
Length | 13 mm |
Memory Density | 268435456 bit |
Memory IC Type | SYNCHRONOUS DRAM |
Memory Width | 32 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 90 |
Number of Words | 8388608 words |
Number of Words Code | 8M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -25 Cel |
Organization | 8MX32 |
Package Body Material | PLASTIC/EPOXY |
Package Code | VFBGA |
Package Equivalence Code | BGA90,9X15,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter |
Power Supplies | 1.8 V |
Qualification Status | Not Qualified |
Refresh Cycles | 4096 |
Seated Height-Max | 1 mm |
Self Refresh | YES |
Sequential Burst Length | 1,2,4,8,FP |
Standby Current-Max | 0.0003 Amp |
Sub Category | DRAMs |
Supply Current-Max | 0.065 mA |
Supply Voltage-Max (Vsup) | 1.95 V |
Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Width | 8 mm |
会社名称 | HYNIX INC. |
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URL | http://www.hynix.com/ |
HY5S5B2CLFP-6E - HYUNDAI の商品詳細ページです。