GS8342D09BGD-250 Gsi

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GS8342D09BGD-250 の詳細情報

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型番GS8342D09BGD-250
メーカーGSI
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 9
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4M
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 Cel
Operating Temperature-Min -40 Cel
Organization 4MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE Meter
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Power Supplies 1.5/1.8,1.8 V
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.185 Amp
Standby Voltage-Min 1.7 V
Sub Category SRAMs
Supply Current-Max 0.46 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm
会社名称GSI Technology designs
設立1995
所在地1213 Elko Drive Sunnyvale, CA 94089 USA
URLhttp://www.gsitechnology.com/

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