CY7C1370D-200BGXC データシート Cypress

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CY7C1370D-200BGXC の詳細情報

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型番CY7C1370D-200BGXC
メーカーCYPRESS
データシートProduct_list_pdf
Access Time-Max 3 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119
JESD-609 Code e1
Length 22 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 119
Number of Words 524288 words
Number of Words Code 512K
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 Cel
Operating Temperature-Min 0 Cel
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY Meter
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Power Supplies 2.5/3.3,3.3 V
Qualification Status Not Qualified
Seated Height-Max 2.4 mm
Standby Current-Max 0.07 Amp
Standby Voltage-Min 3.14 V
Sub Category SRAMs
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm
会社名称Cypress Semiconductor Corporation.
所在地198 Champion Court San Jose, CA 95134 USA
URLhttp://www.cypress.com/

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